Call for Project Participation

Paper/Presentations and Workshop Displays are solicited that address broad range of issues with reliability of Micro and Nano-devices and systems for use by the global aerospace industry.

We encourage you to submit abstracts of your paper that describe

• Best practice on MEMS reliability
  • Reliability testing of Microsystems from academic and industrial resources
  • Lessons learned to aerospace applications
  • Applicable reliability standards in terms of Military Specifications and Space Applications Standards
• MEMS Package reliability:
  • Novel packaging techniques for MNT systems
  • Harsh environment packaging
  • Package characterization
• Radiation
  • Space testing for harsh radiation
  • Radiation tolerance, challenges with MNT reliability
• End-user perspectives.
  • Technical needs
  • Economical constraints
  • General strategy for space qualification of MNT
• Technical Challenges
  • MEMS testing
  • Survey / tutorial on MEMS reliability
  • MEMS Failure Analysis process, tools and case studies
  • MEMS design for reliability
• Existing clusters
  • Open communities
  • Consortium
  • Database
• Other topics related to MEMS reliability are highly sought after and encouraged.

Key Submission and Notification dates

Deadline for Abstract and Posters submission:	March 28th, 2008
Official Letters of Acceptance sent:	April 4th, 2008
Final Manuscripts due:	May 9th, 2008

If you would like to submit a document please fill out our registration form.